High-Performance Solder Paste Machine for Industrial 4.0 MES System
Introduction
The G9+fully automatic solder paste printing machine is a high-end machine for SMT high-end applications, which can meet the printing process requirements of 03015, 0.25 spacing, high precision, and high speed.
Specification
| Model |
G9+ |
| Max PCB Size |
450x340mm |
| Min PCB size |
50x50mm |
| PCB thickness |
0.4-6mm |
| Max board weight |
5kg |
| Transport height |
900±40mm |
| Board edge gap |
2.5mm |
| Board height |
15mm |
| Transport direction |
L-R,R-L |
| Transport speed |
max 1500mm/s, program control |
| Transport method |
One stage |
| WIdth adjustment |
automatic |
| I/O interface |
SMEMA |
| PCB positioning (support method) |
Magnetic pin/support block/manual up-down table |
| PCB clamping system |
Patented over the top clamping
|
| Side clamping |
| Adsorption function |
| Print snap-off |
0-20mm
|
|
Print mode
|
one/twice
|
|
Print Speed
|
10-200mm/sec
|
|
Print Mode
|
One /Twice
|
|
Squeegee Type
|
Rubber /steel Squeegee Blade(Angle 45°/55°/60°)
|
| Print pressure |
0.5-10kg |
| Template fram size |
470*370mm~737*737mm(20-40thickness) |
|
Cleaning System
|
Droops of rain type cleaning system
|
| Reinforced vacuum absorption |
| Dry, wet vacuum three modes |
| Back and forth cleaning |
|
CCD FOV
|
10x8mm
|
| Fiducial mark types |
Standard Fiducial mark shape |
| Pad |
| Hole |
| Camera system |
Look up/down optics structure |
| CCD digital camera |
| Geometry pattern match |
Machine Performance
| Model |
G9+ |
| Repeat position accuracy |
±12.5um@6,CPK≥2.0 |
| Print accuracy |
±18um@6,CPK≥2.0 |
| Print cycle time |
＜7.5 sec |
| Based on the third party test system(CTQ) verify the actual solder paste printing position repeat precision |
Whole Machine Specification
|
Power supply
|
AC:220±10%,50/60HZ, 3.0KW
|
|
Air pressure
|
4~6 kgf/cm²
|
|
Air consumption
|
around 5L/min
|
|
Operating temperature
|
-20℃~+45℃ |
|
Operating humidity
|
30%~60%
|
|
Machine Dimensions(without tower light)
|
1172(L) x 1385(W) x 1530 (H)mm
|
|
Machine Weight
|
Approx: around 1000Kg |
Features
1. CCD digital system, new optical path system, uniform circular light, high brightness of coaxial light source. Using two light source systems, the brightness can be adjusted to an infinite cycle, making it easy to identify different market points (including uneven marking points), such as tin plating, copper plating, silver plating, hot air soldering, FPC, and various types of PCB colors.
2. High precision PCB thickness adjustment, extremely reliable structure, and stable XY motion. Manual adjustment can easily adapt to different PCB thicknesses.
3. Guide rail positioning system, new pattern guide rail board detachable, programmable flexible side clamp, specially designed for FPC and PCB warping, executing a unique clamping device. Through software programming, unaffected PCB picking can be automatically stretched and retracted.
4. The new and innovative scraper structure design adopts a comprehensive scraper system, which improves the stability and service life of the scraper.
5, High speed stencil cleaning, downward dispensing cleaning structure successfully prevents clogged opening(which is always the root cause for ineffective cleaning) from taking place. The length of solvent dispensedcan also be easilyamended with software control.
6, New multi-function interface, simplicity , clearly understand, friendly user. Actual temperature and humidity monitor function.
|
|
High-Performance Solder Paste Machine for Industrial 4.0 MES System Images
|
