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Desktop Automatic Vision Guided PCB Dispensing Machine With AB Glue For PCB Assembly

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Desktop Automatic Vision Guided PCB Dispensing Machine With AB Glue For PCB Assembly

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Brand Name : HSTECH

Certification : CE,ISO

Place of Origin : China

Product Name : Glue Dispensing Machine

Payment Terms : T/T

Supply Ability : 100 PC/Month

Ratio : From 1:1 To 10:1

XYZ Speed : Max 300mm/S

Delivery Time : 10-15 days

Packaging Details : Wooden

Warranty : 1 year

Driven Type : Electric

Drive System : Stepping Motor+Timing Belt

MOQ : 1 PC

Price : Negotiation

Model Number : HS-D331-AB

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Desktop Automatic Vision Guided PCB Dispensing Machine
High Precision 2K/3K Potting & Sealing Robot for PCB & Electronics Assembly
Product Overview
The HS-D331-AB Desktop Automatic Vision Guided AB Glue Dispenser is a compact, high-precision XYZ dispensing robot designed for automated two-component (A/B) glue mixing, dispensing, and potting applications. Built for small to medium-scale production and lab environments, it combines vision-guided positioning, accurate ratio control, and repeatable performance to solve common challenges in electronics manufacturing, PCB assembly, LED modules, power supplies, sensors, and industrial components.
Unlike manual or basic dispensing solutions, this machine delivers consistent glue output, uniform mixing ratios, and precise placement — eliminating human error, reducing waste, and improving both product quality and production efficiency.
Key Features & Technical Advantages
Feature Description
Vision-Guided Alignment System Equipped with high-resolution vision system for automatic Mark point recognition and position compensation. Corrects minor workpiece offsets in real time, ensuring pinpoint dispensing accuracy even on PCB panels, irregular parts, or multi-up assemblies.
High-Precision XYZ Dispensing System Supports points, lines, arcs, circles, and complex 3D non-planar paths. Smooth motion control and micro-line interpolation ensure stable glue flow, consistent bead width, and uniform dispensing volume.
Accurate AB Glue Mixing & Potting Precise A/B mixing ratio control, ideal for epoxy resin, silicone, PU, and conductive adhesives. Ensures uniform curing, strong bonding, and consistent material properties.
Stable & Clean Dispensing Performance Dedicated dispensing controller prevents dripping, trailing, or leakage, maintaining clean production conditions. Consistent glue output reduces waste and rework.
User-Friendly Teach Pendant Programming Intuitive teach pendant interface requires no complex software or coding. Quick setup, editing, and storage of dispensing programs minimizes changeover time.
Flexible & Expandable Configuration Compatible with various glue guns, custom fixtures, heating/temperature control systems, and optional upgrades. Adaptable to wide range of product sizes and process requirements.
Compact Desktop Design Space-saving footprint fits easily into existing workstations, labs, or production lines. Perfect for small-batch production, prototyping, and flexible manufacturing setups.
Core Functions
  • Vision-Guided Dispensing: Automatically identifies Mark points, compensates for misalignment, reduces manual alignment time by up to 90%, supports multi-up and irregular parts
  • Two-Component (A/B) Glue Control: Precision metering pumps ensure accurate mixing ratios, static or dynamic mixing options, eliminates uneven curing and weak bonds
  • Complex Path Programming: Supports 2D paths and advanced 3D non-planar trajectories, micro-line interpolation prevents glue splashing, program storage for quick recipe recall
  • Stable & Repeatable Performance: Closed-loop control system maintains consistent dispensing, anti-drip functions ensure clean cut-off, repeatability within tight tolerances
Technical Specifications
Model HS-D331-AB
Working Range (X/Y/Z) 300 × 300 × 100 mm
XYZ Speed Max. 300 mm/s
AB Glue Mixing Ratio 10:1 or customizable
Drive System Stepping motor + timing belt
Repeatability ±0.01 mm
Potting Precision Amount ±1%, Ratio ±1%
Operation Mode Automatic
Programming Teach pendant
Control System Board card
Working Temperature 10-40°C
Weight 45 kg
Dimensions (L×W×H) 510 × 620 × 610 mm
Power Supply AC 110-220V, 50/60Hz, 300W
Typical Applications
PCB Assembly & Component Encapsulation
LED Module Potting & Lens Bonding
Power Supply Module Encapsulation
Automotive Electronics Sealing
Industrial Sensor Encapsulation
Medical & Consumer Electronics
Conformal Coating Applications
Waterproofing & Environmental Protection

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