High-efficiency PCB Surface Cleaner SMT Line Dust & Static Removal Machine With SMEMA
The HSTECH HS-DC250 / HS-DC330 PCB Surface Cleaner is a high-precision, fully automated cleaning solution purpose-built for modern SMT (Surface Mount Technology) production lines. Installed directly before the screen printing process, this machine eliminates dust, glass fibers, static electricity, and other surface contaminants from PCBs, ensuring optimal solder paste printing quality and minimizing assembly defects like tombstoning, solder balls, and insufficient wetting.
Product Overview
Engineered for seamless integration into SMT workflows, it supports standard SMEMA communication, bidirectional board transport, and user-friendly multilingual operation, making it ideal for consumer electronics, automotive electronics, and industrial PCB manufacturing applications.
Key Features
- SMT Line-optimized Design: Developed to meet specific SMT production requirements with PLC control for stable, consistent operation. Supports installation before/after SMT printers and AI plug-in equipment.
- High-efficiency Cleaning System: Combines ultra-high-speed anti-static spiral brushes and vacuum extraction to remove surface particles with 99%+ cleanliness rate.
- Advanced Static Elimination: Optional Keyence-brand static eliminators completely eliminate electrostatic interference, protecting sensitive PCB components from ESD damage.
- Low-maintenance Performance: Roller cleaning mechanism designed for long-lasting, stable results with draw-out design for simplified maintenance.
- User-friendly Operation: Dual-language (English/Chinese) interface display with SMEMA signal compatibility for seamless SMT line integration.
Specifications
| Item |
HS-DC250 |
HS-DC330 |
| Effective PCB Size |
50×50~330×250mm |
50×50~455×330mm |
| Machine Dimension |
650×800×1300mm |
800×950×1300mm |
| Weight |
100kg |
130kg |
Technical Parameters
| Parameter |
Specification |
| Transport Height |
900±30mm (industry standard SMT line height) |
| Transportation Direction |
Left-to-Right (L->R) or Right-to-Left (R->L) bidirectional |
| Cycle Time |
Approx 8 seconds per PCB |
| Sticker Roller Qty |
1 reel |
| Adhesive Paper Qty |
2 reels |
| Ionizer Qty |
2 pcs (static elimination units) |
| Brush Qty |
1 pc |
| Track Fixed Side |
Front side |
| Power Supply |
AC100-230V, 50/60Hz |
| Air Pressure |
4-6 bar |
| Air Consumption |
Max 10L/min |
| PCB Thickness Range |
0.4~5mm |
| Communication Protocol |
SMEMA (standard SMT equipment communication) |
Working Principle & Benefits
Multi-stage Cleaning Process:
- Brush Cleaning: High-speed anti-static spiral brushes dislodge surface dust, fibers, and particles
- Vacuum Extraction: Integrated vacuum system removes loosened contaminants to prevent recontamination
- Static Elimination: Ionizers neutralize static electricity, eliminating ESD damage risk to components
- Adhesive Roller Touch Cleaning: Precision adhesive rollers capture residual particles, achieving 99%+ cleanliness
Key Benefits:
- Reduce printing defects by up to 70% caused by surface contamination
- Improve solder joint reliability and final product yield
- Extend service life of downstream equipment like printers and placement machines
- Minimize manual cleaning and rework, boosting overall line efficiency
Application Scenarios
- Consumer electronics assembly lines (smartphones, laptops, wearables)
- Automotive electronics manufacturing (ECUs, sensors, control modules)
- Industrial control PCB production
- Medical device electronics assembly
- Any SMT production process requiring high-precision solder paste printing
Product Images
